AWBM 80 AUTOMATIC WAFER BAKING MACHINE 80 PLATE

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AWBM 80 AUTOMATIC WAFER BAKING MACHINE 80 PLATE

Baking Machine

AWBM 80 AUTOMATIC WAFER BAKING MACHINE 80 PLATE

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  • Baking plate size 500mm x 350mm

Baking plate engraving according to the specs from the customer
The wafer thickness adjustable range 2.5 mm – 3.2 mm

  • Siemens S7-1500 PLC and 12” Siemens comfort panel with user friendly HMI system and automatic production reporting system, control cabinet equipped with air conditioning unit

  • Pilz safety system 

  • Kromschroder gas heating system, high energy efficiency and accurate temperature controlling

  • Rotary lobe batter pump and batter optimization system 

  • Greaseable baking plate bearings for saving maintenance time, running wheels and locking rollers German made

  • Robust main drive and chain tension design 

  • Locking hook system design and with locking and opening monitoring function

  • Equipped with baking ledges for dying the bubble waste

  • Maximum speed 42 sheet/m for the 2.7mm thickness wafer

  • 99% good wafer sheet and 5% bubble waste guaranteed